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BibTeX record journals/tcad/DangAAT22
@article{DBLP:journals/tcad/DangAAT22, author = {Khanh N. Dang and Akram Ben Ahmed and Abderazek Ben Abdallah and Xuan{-}Tu Tran}, title = {HotCluster: {A} Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems}, journal = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.}, volume = {41}, number = {4}, pages = {799--812}, year = {2022}, url = {https://doi.org/10.1109/TCAD.2021.3069370}, doi = {10.1109/TCAD.2021.3069370}, timestamp = {Fri, 01 Apr 2022 11:24:46 +0200}, biburl = {https://dblp.org/rec/journals/tcad/DangAAT22.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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