BibTeX record journals/tcad/DangAAT22

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@article{DBLP:journals/tcad/DangAAT22,
  author       = {Khanh N. Dang and
                  Akram Ben Ahmed and
                  Abderazek Ben Abdallah and
                  Xuan{-}Tu Tran},
  title        = {HotCluster: {A} Thermal-Aware Defect Recovery Method for Through-Silicon-Vias
                  Toward Reliable 3-D ICs Systems},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {41},
  number       = {4},
  pages        = {799--812},
  year         = {2022},
  url          = {https://doi.org/10.1109/TCAD.2021.3069370},
  doi          = {10.1109/TCAD.2021.3069370},
  timestamp    = {Fri, 01 Apr 2022 11:24:46 +0200},
  biburl       = {https://dblp.org/rec/journals/tcad/DangAAT22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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