BibTeX record journals/tcad/CongKM01

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@article{DBLP:journals/tcad/CongKM01,
  author       = {Jason Cong and
                  Cheng{-}Kok Koh and
                  Patrick H. Madden},
  title        = {Interconnect layout optimization under higher order {RLC} model forMCM
                  designs},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {20},
  number       = {12},
  pages        = {1455--1463},
  year         = {2001},
  url          = {https://doi.org/10.1109/43.969438},
  doi          = {10.1109/43.969438},
  timestamp    = {Thu, 24 Sep 2020 11:28:41 +0200},
  biburl       = {https://dblp.org/rec/journals/tcad/CongKM01.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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