BibTeX record journals/sensors/DongLNWZHWWHL21

download as .bib file

@article{DBLP:journals/sensors/DongLNWZHWWHL21,
  author       = {Hongyu Dong and
                  Huiming Liu and
                  Arata Nishimura and
                  Zhixiong Wu and
                  Hengcheng Zhang and
                  Yemao Han and
                  Tao Wang and
                  Yongguang Wang and
                  Chuanjun Huang and
                  Laifeng Li},
  title        = {Monitoring Strain Response of Epoxy Resin during Curing and Cooling
                  Using an Embedded Strain Gauge},
  journal      = {Sensors},
  volume       = {21},
  number       = {1},
  pages        = {172},
  year         = {2021},
  url          = {https://doi.org/10.3390/s21010172},
  doi          = {10.3390/S21010172},
  timestamp    = {Sun, 02 Oct 2022 15:48:10 +0200},
  biburl       = {https://dblp.org/rec/journals/sensors/DongLNWZHWWHL21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.