BibTeX record journals/mr/ZhuangCCS01

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@article{DBLP:journals/mr/ZhuangCCS01,
  author       = {W. D. Zhuang and
                  P. C. Chang and
                  F. Y. Chou and
                  R. K. Shiue},
  title        = {Effect of solder creep on the reliability of large area die attachment},
  journal      = {Microelectron. Reliab.},
  volume       = {41},
  number       = {12},
  pages        = {2011--2021},
  year         = {2001},
  url          = {https://doi.org/10.1016/S0026-2714(01)00101-9},
  doi          = {10.1016/S0026-2714(01)00101-9},
  timestamp    = {Sat, 22 Feb 2020 19:29:13 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZhuangCCS01.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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