BibTeX record journals/mr/ZhuCW18

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@article{DBLP:journals/mr/ZhuCW18,
  author       = {Ze Zhu and
                  Yan{-}Cheong Chan and
                  Fengshun Wu},
  title        = {Failure mechanisms of solder interconnects under current stressing
                  in advanced electronic packages: An update on the effect of alternating
                  current {(AC)} stressing},
  journal      = {Microelectron. Reliab.},
  volume       = {91},
  pages        = {179--182},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2018.10.002},
  doi          = {10.1016/J.MICROREL.2018.10.002},
  timestamp    = {Sat, 22 Feb 2020 19:27:39 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZhuCW18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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