BibTeX record journals/mr/ZhangXGSYCDJG10

• > Home > journals/mr/ZhangXGSYCDJG10

@article{DBLP:journals/mr/ZhangXGSYCDJG10,
  author       = {Liang Zhang and
                  Songbai Xue and
                  Li{-}li Gao and
                  Zhong Sheng and
                  Sheng{-}lin Yu and
                  Yan Chen and
                  Wei Dai and
                  Feng Ji and
                  Zeng Guang},
  title        = {Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages},
  journal      = {Microelectron. Reliab.},
  volume       = {50},
  number       = {12},
  pages        = {2071--2077},
  year         = {2010},
  url          = {https://doi.org/10.1016/j.microrel.2010.05.008},
  doi          = {10.1016/J.MICROREL.2010.05.008},
  timestamp    = {Fri, 10 Jun 2022 20:41:05 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/ZhangXGSYCDJG10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}