BibTeX record journals/mr/ZhangWLCMTPS04

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@article{DBLP:journals/mr/ZhangWLCMTPS04,
  author       = {Xiaowu Zhang and
                  Ee{-}Hua Wong and
                  Charles Lee and
                  Tai Chong Chai and
                  Yiyi Ma and
                  Poi{-}Siong Teo and
                  D. Pinjala and
                  Srinivasamurthy Sampath},
  title        = {Thermo-mechanical finite element analysis in a multichip build up
                  substrate based package design},
  journal      = {Microelectron. Reliab.},
  volume       = {44},
  number       = {4},
  pages        = {611--619},
  year         = {2004},
  url          = {https://doi.org/10.1016/j.microrel.2003.09.006},
  doi          = {10.1016/J.MICROREL.2003.09.006},
  timestamp    = {Mon, 26 Oct 2020 08:59:29 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZhangWLCMTPS04.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}