BibTeX record journals/mr/ZhangLHP17

download as .bib file

@article{DBLP:journals/mr/ZhangLHP17,
  author       = {Shuye Zhang and
                  Tiesong Lin and
                  Peng He and
                  Kyung{-}Wook Paik},
  title        = {Effects of acrylic adhesives property and optimized bonding parameters
                  on Sn-58Bi solder joint morphology for flex-on-board assembly},
  journal      = {Microelectron. Reliab.},
  volume       = {78},
  pages        = {181--189},
  year         = {2017},
  url          = {https://doi.org/10.1016/j.microrel.2017.08.009},
  doi          = {10.1016/J.MICROREL.2017.08.009},
  timestamp    = {Sat, 22 Feb 2020 19:29:29 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZhangLHP17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics