BibTeX record journals/mr/ZengBJ13

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@article{DBLP:journals/mr/ZengBJ13,
  author       = {Yingzhi Zeng and
                  Kewu Bai and
                  Hongmei Jin},
  title        = {Thermodynamic study on the corrosion mechanism of copper wire bonding},
  journal      = {Microelectron. Reliab.},
  volume       = {53},
  number       = {7},
  pages        = {985--1001},
  year         = {2013},
  url          = {https://doi.org/10.1016/j.microrel.2013.03.006},
  doi          = {10.1016/J.MICROREL.2013.03.006},
  timestamp    = {Sat, 22 Feb 2020 19:28:18 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZengBJ13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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