C. Yuan W. D. van Driel Richard B. R. van Silfhout Olaf van der Sluis R. A. B. Engelen Leo J. Ernst F. van Keulen G. Q. Zhang Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. 1679-1684 2006 46 Microelectronics Reliability 9-11 http://dx.doi.org/10.1016/j.microrel.2006.07.054 db/journals/mr/mr46.html#YuanDSSEEKZ06