BibTeX record: journals/mr/YuanDSSEEKZ06

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@article{DBLP:journals/mr/YuanDSSEEKZ06,
  author    = {C. Yuan and
               W. D. van Driel and
               Richard B. R. van Silfhout and
               Olaf van der Sluis and
               R. A. B. Engelen and
               Leo J. Ernst and
               F. van Keulen and
               G. Q. Zhang},
  title     = {Delamination analysis of Cu/low-k technology subjected to chemical-mechanical
               polishing process conditions.},
  journal   = {Microelectronics Reliability},
  year      = {2006},
  volume    = {46},
  number    = {9-11},
  pages     = {1679--1684},
  url       = {http://dx.doi.org/10.1016/j.microrel.2006.07.054},
  doi       = {10.1016/j.microrel.2006.07.054},
  timestamp = {Wed, 03 Sep 2014 02:04:08 +0200},
  biburl    = {http://dblp.uni-trier.de/rec/bib/journals/mr/YuanDSSEEKZ06},
  bibsource = {dblp computer science bibliography, http://dblp.org}
}