YuanDSSEEKZ06'

@article{DBLP:journals/mr/YuanDSSEEKZ06,
  author    = {C. Yuan and
               W. D. van Driel and
               Richard B. R. van Silfhout and
               Olaf van der Sluis and
               R. A. B. Engelen and
               Leo J. Ernst and
               F. van Keulen and
               G. Q. Zhang},
  title     = {Delamination analysis of Cu/low-k technology subjected to
               chemical-mechanical polishing process conditions},
  journal   = {Microelectronics Reliability},
  volume    = {46},
  number    = {9-11},
  year      = {2006},
  pages     = {1679-1684},
  ee        = {http://dx.doi.org/10.1016/j.microrel.2006.07.054},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}