@article{DBLP:journals/mr/YoshidaM04,
author = {Katsuhito Yoshida and
Hideaki Morigami},
title = {Thermal properties of diamond/copper composite material},
journal = {Microelectronics Reliability},
volume = {44},
number = {2},
year = {2004},
pages = {303-308},
ee = {http://dx.doi.org/10.1016/S0026-2714(03)00215-4},
bibsource = {DBLP, http://dblp.uni-trier.de}
}