BibTeX record journals/mr/YinLYWB18

download as .bib file

@article{DBLP:journals/mr/YinLYWB18,
  author       = {Limeng Yin and
                  Dong Li and
                  Zongxiang Yao and
                  Gang Wang and
                  Adrian Blackburn},
  title        = {Microstructures and properties of Bi10Ag high temperature solder doped
                  with Cu element},
  journal      = {Microelectron. Reliab.},
  volume       = {80},
  pages        = {79--84},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2017.11.013},
  doi          = {10.1016/J.MICROREL.2017.11.013},
  timestamp    = {Sat, 22 Feb 2020 19:28:55 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/YinLYWB18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.