BibTeX record journals/mr/YimKOKSLK12

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@article{DBLP:journals/mr/YimKOKSLK12,
  author       = {Byung{-}seung Yim and
                  Yumi Kwon and
                  Seung Hoon Oh and
                  Jooheon Kim and
                  Yong{-}Eui Shin and
                  Seong Hyuk Lee and
                  Jongmin Kim},
  title        = {Characteristics of solderable electrically conductive adhesives (ECAs)
                  for electronic packaging},
  journal      = {Microelectron. Reliab.},
  volume       = {52},
  number       = {6},
  pages        = {1165--1173},
  year         = {2012},
  url          = {https://doi.org/10.1016/j.microrel.2011.12.004},
  doi          = {10.1016/J.MICROREL.2011.12.004},
  timestamp    = {Fri, 11 Nov 2022 11:18:11 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/YimKOKSLK12.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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