DBLP Record 'journals/mr/YauGC04'

BibTeX

@article{DBLP:journals/mr/YauGC04,
  author    = {Esther Wai Ching Yau and
               Jing Feng Gong and
               Philip Chan},
  title     = {Al surface morphology effect on flip-chip solder bump shear
               strength},
  journal   = {Microelectronics Reliability},
  volume    = {44},
  number    = {2},
  year      = {2004},
  pages     = {323-331},
  ee        = {http://dx.doi.org/10.1016/S0026-2714(03)00159-8},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}