BibTeX record journals/mr/YaoLC03

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@article{DBLP:journals/mr/YaoLC03,
  author       = {Y. F. Yao and
                  T. Y. Lin and
                  K. H. Chua},
  title        = {Improving the deflection of wire bonds in stacked chip scale package
                  {(CSP)}},
  journal      = {Microelectron. Reliab.},
  volume       = {43},
  number       = {12},
  pages        = {2039--2045},
  year         = {2003},
  url          = {https://doi.org/10.1016/S0026-2714(03)00211-7},
  doi          = {10.1016/S0026-2714(03)00211-7},
  timestamp    = {Sat, 22 Feb 2020 19:27:06 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/YaoLC03.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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