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BibTeX record journals/mr/YangSL14
@article{DBLP:journals/mr/YangSL14, author = {Chaoran Yang and Fubin Song and S. W. Ricky Lee}, title = {Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni {(SCN)} lead-free solder joints}, journal = {Microelectron. Reliab.}, volume = {54}, number = {2}, pages = {435--446}, year = {2014}, url = {https://doi.org/10.1016/j.microrel.2013.10.005}, doi = {10.1016/J.MICROREL.2013.10.005}, timestamp = {Thu, 14 Oct 2021 09:38:44 +0200}, biburl = {https://dblp.org/rec/journals/mr/YangSL14.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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