BibTeX record journals/mr/YangLJL06

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@article{DBLP:journals/mr/YangLJL06,
  author       = {Se Young Yang and
                  Wang{-}Joo Lee and
                  S. H. Jeong and
                  S. J. Lee},
  title        = {Structural reliability assessment of multi-stack package {(MSP)} under
                  high temperature storage {(HTS)} testing condition},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {9-11},
  pages        = {1904--1909},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2006.07.089},
  doi          = {10.1016/J.MICROREL.2006.07.089},
  timestamp    = {Fri, 19 Jan 2024 08:33:20 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/YangLJL06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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