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BibTeX record journals/mr/YangLJL06
@article{DBLP:journals/mr/YangLJL06, author = {Se Young Yang and Wang{-}Joo Lee and S. H. Jeong and S. J. Lee}, title = {Structural reliability assessment of multi-stack package {(MSP)} under high temperature storage {(HTS)} testing condition}, journal = {Microelectron. Reliab.}, volume = {46}, number = {9-11}, pages = {1904--1909}, year = {2006}, url = {https://doi.org/10.1016/j.microrel.2006.07.089}, doi = {10.1016/J.MICROREL.2006.07.089}, timestamp = {Fri, 19 Jan 2024 08:33:20 +0100}, biburl = {https://dblp.org/rec/journals/mr/YangLJL06.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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