BibTeX record journals/mr/YamanakaTS07

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@article{DBLP:journals/mr/YamanakaTS07,
  author       = {Kimihiro Yamanaka and
                  Yutaka Tsukada and
                  Katsuaki Suganuma},
  title        = {Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system},
  journal      = {Microelectron. Reliab.},
  volume       = {47},
  number       = {8},
  pages        = {1280--1287},
  year         = {2007},
  url          = {https://doi.org/10.1016/j.microrel.2006.09.028},
  doi          = {10.1016/J.MICROREL.2006.09.028},
  timestamp    = {Sat, 22 Feb 2020 19:27:48 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/YamanakaTS07.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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