BibTeX record journals/mr/YamadaTYNASOI07

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@article{DBLP:journals/mr/YamadaTYNASOI07,
  author       = {Yasushi Yamada and
                  Yoshikazu Takaku and
                  Yuji Yagi and
                  Ikuo Nakagawa and
                  Takashi Atsumi and
                  Mikio Shirai and
                  Ikuo Ohnuma and
                  Kiyohito Ishida},
  title        = {Reliability of wire-bonding and solder joint for high temperature
                  operation of power semiconductor device},
  journal      = {Microelectron. Reliab.},
  volume       = {47},
  number       = {12},
  pages        = {2147--2151},
  year         = {2007},
  url          = {https://doi.org/10.1016/j.microrel.2007.07.102},
  doi          = {10.1016/J.MICROREL.2007.07.102},
  timestamp    = {Sat, 30 Sep 2023 10:21:36 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/YamadaTYNASOI07.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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