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BibTeX record journals/mr/YamadaTYNASOI07
@article{DBLP:journals/mr/YamadaTYNASOI07, author = {Yasushi Yamada and Yoshikazu Takaku and Yuji Yagi and Ikuo Nakagawa and Takashi Atsumi and Mikio Shirai and Ikuo Ohnuma and Kiyohito Ishida}, title = {Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device}, journal = {Microelectron. Reliab.}, volume = {47}, number = {12}, pages = {2147--2151}, year = {2007}, url = {https://doi.org/10.1016/j.microrel.2007.07.102}, doi = {10.1016/J.MICROREL.2007.07.102}, timestamp = {Sat, 30 Sep 2023 10:21:36 +0200}, biburl = {https://dblp.org/rec/journals/mr/YamadaTYNASOI07.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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