BibTeX record journals/mr/XuLSCWS11

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@article{DBLP:journals/mr/XuLSCWS11,
  author       = {H. Xu and
                  C. Liu and
                  Vadim V. Silberschmidt and
                  Zhong Chen and
                  J. Wei and
                  M. Sivakumar},
  title        = {Effect of bonding duration and substrate temperature in copper ball
                  bonding on aluminium pads: {A} {TEM} study of interfacial evolution},
  journal      = {Microelectron. Reliab.},
  volume       = {51},
  number       = {1},
  pages        = {113--118},
  year         = {2011},
  url          = {https://doi.org/10.1016/j.microrel.2010.03.016},
  doi          = {10.1016/J.MICROREL.2010.03.016},
  timestamp    = {Sat, 22 Feb 2020 19:28:27 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/XuLSCWS11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}