BibTeX record journals/mr/WuZLHL06

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@article{DBLP:journals/mr/WuZLHL06,
  author       = {J. D. Wu and
                  P. J. Zheng and
                  C. W. Lee and
                  S. C. Hung and
                  J. J. Lee},
  title        = {A study in flip-chip UBM/bump reliability with effects of SnPb solder
                  composition},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {1},
  pages        = {41--52},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2005.01.012},
  doi          = {10.1016/J.MICROREL.2005.01.012},
  timestamp    = {Sat, 22 Feb 2020 19:27:57 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/WuZLHL06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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