BibTeX record journals/mr/WuYCLWLL08

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@article{DBLP:journals/mr/WuYCLWLL08,
  author       = {Zhenyu Wu and
                  Yintang Yang and
                  Changchun Chai and
                  Yuejin Li and
                  JiaYou Wang and
                  Jing Liu and
                  Bin Liu},
  title        = {Temperature-dependent stress-induced voiding in dual-damascene Cu
                  interconnects},
  journal      = {Microelectron. Reliab.},
  volume       = {48},
  number       = {4},
  pages        = {578--583},
  year         = {2008},
  url          = {https://doi.org/10.1016/j.microrel.2007.12.001},
  doi          = {10.1016/J.MICROREL.2007.12.001},
  timestamp    = {Thu, 08 Feb 2024 07:48:55 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/WuYCLWLL08.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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