BibTeX record journals/mr/WongSS08

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@article{DBLP:journals/mr/WongSS08,
  author       = {Ee{-}Hua Wong and
                  S. K. W. Seah and
                  V. P. W. Shim},
  title        = {A review of board level solder joints for mobile applications},
  journal      = {Microelectron. Reliab.},
  volume       = {48},
  number       = {11-12},
  pages        = {1747--1758},
  year         = {2008},
  url          = {https://doi.org/10.1016/j.microrel.2008.08.006},
  doi          = {10.1016/J.MICROREL.2008.08.006},
  timestamp    = {Sat, 22 Feb 2020 19:26:55 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/WongSS08.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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