BibTeX record journals/mr/WongCSS16

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@article{DBLP:journals/mr/WongCSS16,
  author       = {Ee{-}Hua Wong and
                  J. Chrisp and
                  C. S. Selvanayagam and
                  S. K. W. Seah},
  title        = {Constitutive modeling of solder alloys for drop-impact applications},
  journal      = {Microelectron. Reliab.},
  volume       = {67},
  pages        = {135--142},
  year         = {2016},
  url          = {https://doi.org/10.1016/j.microrel.2016.10.007},
  doi          = {10.1016/J.MICROREL.2016.10.007},
  timestamp    = {Sat, 22 Feb 2020 19:27:02 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/WongCSS16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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