BibTeX record journals/mr/WeiHYSKM17

download as .bib file

@article{DBLP:journals/mr/WeiHYSKM17,
  author       = {Hsiu{-}Ping Wei and
                  Bongtae Han and
                  Byeng Dong Youn and
                  Hyuk Shin and
                  Ilho Kim and
                  Hojeong Moon},
  title        = {Assembly yield prediction of plastically encapsulated packages with
                  a large number of manufacturing variables by advanced approximate
                  integration method},
  journal      = {Microelectron. Reliab.},
  volume       = {78},
  pages        = {319--330},
  year         = {2017},
  url          = {https://doi.org/10.1016/j.microrel.2017.09.006},
  doi          = {10.1016/J.MICROREL.2017.09.006},
  timestamp    = {Sat, 22 Feb 2020 19:27:11 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/WeiHYSKM17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.