BibTeX record journals/mr/WangLL08

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@article{DBLP:journals/mr/WangLL08,
  author       = {Tong Hong Wang and
                  Yi{-}Shao Lai and
                  Yu{-}Cheng Lin},
  title        = {Reliability evaluations for board-level chip-scale packages under
                  coupled power and thermal cycling test conditions},
  journal      = {Microelectron. Reliab.},
  volume       = {48},
  number       = {1},
  pages        = {132--139},
  year         = {2008},
  url          = {https://doi.org/10.1016/j.microrel.2007.02.011},
  doi          = {10.1016/J.MICROREL.2007.02.011},
  timestamp    = {Sat, 22 Feb 2020 19:28:36 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/WangLL08.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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