BibTeX record journals/mr/WangLK09

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@article{DBLP:journals/mr/WangLK09,
  author       = {Yi{-}Wun Wang and
                  Y. W. Lin and
                  C. Robert Kao},
  title        = {Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free
                  solders and different Cu substrates},
  journal      = {Microelectron. Reliab.},
  volume       = {49},
  number       = {3},
  pages        = {248--252},
  year         = {2009},
  url          = {https://doi.org/10.1016/j.microrel.2008.09.010},
  doi          = {10.1016/J.MICROREL.2008.09.010},
  timestamp    = {Sat, 09 Apr 2022 12:31:59 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/WangLK09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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