BibTeX record journals/mr/WangLCWC06

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@article{DBLP:journals/mr/WangLCWC06,
  author       = {Robin C. J. Wang and
                  C. C. Lee and
                  L. D. Chen and
                  Kenneth Wu and
                  K. S. Chang{-}Liao},
  title        = {A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure
                  effect},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {9-11},
  pages        = {1673--1678},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2006.07.053},
  doi          = {10.1016/J.MICROREL.2006.07.053},
  timestamp    = {Sat, 22 Feb 2020 19:27:01 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/WangLCWC06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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