BibTeX record journals/mr/WangC12a

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@article{DBLP:journals/mr/WangC12a,
  author       = {Fuliang Wang and
                  Yun Chen},
  title        = {Modeling study of thermosonic flip chip bonding process},
  journal      = {Microelectron. Reliab.},
  volume       = {52},
  number       = {11},
  pages        = {2749--2755},
  year         = {2012},
  url          = {https://doi.org/10.1016/j.microrel.2012.03.029},
  doi          = {10.1016/J.MICROREL.2012.03.029},
  timestamp    = {Sat, 22 Feb 2020 19:26:41 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/WangC12a.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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