Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle.

Jinlin Wang Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle. 293-299 2002 42 Microelectronics Reliability 2 http://dx.doi.org/10.1016/S0026-2714(01)00231-1 db/journals/mr/mr42.html#Wang02