@article{DBLP:journals/mr/VriesDS05,
author = {J. de Vries and
J. van Delft and
C. Slob},
title = {100 mum Pitch flip chip on foil assemblies with adhesive
interconnections},
journal = {Microelectronics Reliability},
volume = {45},
number = {3-4},
year = {2005},
pages = {527-534},
ee = {http://dx.doi.org/10.1016/j.microrel.2004.06.006},
bibsource = {DBLP, http://dblp.uni-trier.de}
}
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