Bart Vandevelde Mario Gonzalez Paresh Limaye Petar Ratchev Eric Beyne Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. 259-265 2007 47 Microelectronics Reliability 2-3 http://dx.doi.org/10.1016/j.microrel.2006.09.034 db/journals/mr/mr47.html#VandeveldeGLRB07