BibTeX record journals/mr/TeeZ04

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@article{DBLP:journals/mr/TeeZ04,
  author       = {Tong Yan Tee and
                  Zhaowei Zhong},
  title        = {Integrated vapor pressure, hygroswelling, and thermo-mechanical stress
                  modeling of {QFN} package during reflow with interfacial fracture
                  mechanics analysis},
  journal      = {Microelectron. Reliab.},
  volume       = {44},
  number       = {1},
  pages        = {105--114},
  year         = {2004},
  url          = {https://doi.org/10.1016/j.microrel.2003.07.004},
  doi          = {10.1016/J.MICROREL.2003.07.004},
  timestamp    = {Sat, 22 Feb 2020 19:28:43 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/TeeZ04.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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