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BibTeX record journals/mr/TeeZ04
@article{DBLP:journals/mr/TeeZ04, author = {Tong Yan Tee and Zhaowei Zhong}, title = {Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of {QFN} package during reflow with interfacial fracture mechanics analysis}, journal = {Microelectron. Reliab.}, volume = {44}, number = {1}, pages = {105--114}, year = {2004}, url = {https://doi.org/10.1016/j.microrel.2003.07.004}, doi = {10.1016/J.MICROREL.2003.07.004}, timestamp = {Sat, 22 Feb 2020 19:28:43 +0100}, biburl = {https://dblp.org/rec/journals/mr/TeeZ04.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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