BibTeX record journals/mr/TeeNZ06

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@article{DBLP:journals/mr/TeeNZ06,
  author       = {Tong Yan Tee and
                  Hun Shen Ng and
                  Zhaowei Zhong},
  title        = {Board level solder joint reliability analysis of stacked die mixed
                  flip-chip and wirebond {BGA}},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {12},
  pages        = {2131--2138},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2006.01.010},
  doi          = {10.1016/J.MICROREL.2006.01.010},
  timestamp    = {Sat, 22 Feb 2020 19:27:46 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/TeeNZ06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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