BibTeX
@article{DBLP:journals/mr/StoyanovKBD07,
author = {Stoyan Stoyanov and
Robert W. Kay and
Chris Bailey and
Marc P. Y. Desmulliez},
title = {Computational modelling for reliable flip-chip packaging
at sub-100mum pitch using isotropic conductive adhesives},
journal = {Microelectronics Reliability},
volume = {47},
number = {1},
year = {2007},
pages = {132-141},
ee = {http://dx.doi.org/10.1016/j.microrel.2006.01.004},
bibsource = {DBLP, http://dblp.uni-trier.de}
}
Copyright © 2008-06-01 by Michael Ley (ley@uni-trier.de)