BibTeX record journals/mr/ShiWP03

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@article{DBLP:journals/mr/ShiWP03,
  author       = {X. Q. Shi and
                  Z. P. Wang and
                  J. P. Pickering},
  title        = {A new methodology for the characterization of fracture toughness of
                  filled epoxy films involved in microelectronics packages},
  journal      = {Microelectron. Reliab.},
  volume       = {43},
  number       = {7},
  pages        = {1105--1115},
  year         = {2003},
  url          = {https://doi.org/10.1016/S0026-2714(03)00100-8},
  doi          = {10.1016/S0026-2714(03)00100-8},
  timestamp    = {Sat, 22 Feb 2020 19:28:47 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ShiWP03.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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