BibTeX record journals/mr/ShiCTZPU12

• > Home > journals/mr/ShiCTZPU12

@article{DBLP:journals/mr/ShiCTZPU12,
  author       = {Hongbin Shi and
                  F. X. Che and
                  Cuihua Tian and
                  Rui Zhang and
                  Jong Tae Park and
                  Toshitsugu Ueda},
  title        = {Analysis of edge and corner bonded PSvfBGA reliability under thermal
                  cycling conditions by experimental and finite element methods},
  journal      = {Microelectron. Reliab.},
  volume       = {52},
  number       = {9-10},
  pages        = {1870--1875},
  year         = {2012},
  url          = {https://doi.org/10.1016/j.microrel.2012.06.089},
  doi          = {10.1016/J.MICROREL.2012.06.089},
  timestamp    = {Fri, 22 Apr 2022 10:15:41 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/ShiCTZPU12.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}