BibTeX record journals/mr/SeoKSL09

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@article{DBLP:journals/mr/SeoKSL09,
  author       = {Sun{-}Kyoung Seo and
                  Sung K. Kang and
                  Da{-}Yuan Shih and
                  Hyuck Mo Lee},
  title        = {The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu
                  solders during high temperature aging},
  journal      = {Microelectron. Reliab.},
  volume       = {49},
  number       = {3},
  pages        = {288--295},
  year         = {2009},
  url          = {https://doi.org/10.1016/j.microrel.2008.11.014},
  doi          = {10.1016/J.MICROREL.2008.11.014},
  timestamp    = {Sat, 22 Feb 2020 19:28:40 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/SeoKSL09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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