DBLP Record 'journals/mr/RoyTKC05'

BibTeX

@article{DBLP:journals/mr/RoyTKC05,
  author    = {Arijit Roy and
               Cher Ming Tan and
               Rakesh Kumar and
               Xian Tong Chen},
  title     = {Effect of test condition and stress free temperature on
               the electromigration failure of Cu dual damascene submicron
               interconnect line-via test structures},
  journal   = {Microelectronics Reliability},
  volume    = {45},
  number    = {9-11},
  year      = {2005},
  pages     = {1443-1448},
  ee        = {http://dx.doi.org/10.1016/j.microrel.2005.07.042},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}