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DBLP Record 'journals/mr/RoyT06'

BibTeX

@article{DBLP:journals/mr/RoyT06,
  author    = {Arijit Roy and
               Cher Ming Tan},
  title     = {Experimental investigation on the impact of stress free
               temperature on the electromigration performance of copper
               dual damascene submicron interconnect},
  journal   = {Microelectronics Reliability},
  volume    = {46},
  number    = {9-11},
  year      = {2006},
  pages     = {1652-1656},
  ee        = {http://dx.doi.org/10.1016/j.microrel.2006.07.036},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}

Copyright © 2007-03-27 by Michael Ley (ley@uni-trier.de)