BibTeX
@article{DBLP:journals/mr/RoyT06,
author = {Arijit Roy and
Cher Ming Tan},
title = {Experimental investigation on the impact of stress free
temperature on the electromigration performance of copper
dual damascene submicron interconnect},
journal = {Microelectronics Reliability},
volume = {46},
number = {9-11},
year = {2006},
pages = {1652-1656},
ee = {http://dx.doi.org/10.1016/j.microrel.2006.07.036},
bibsource = {DBLP, http://dblp.uni-trier.de}
}
Copyright © 2007-03-27 by Michael Ley (ley@uni-trier.de)