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BibTeX record journals/mr/PengKCKC06
@article{DBLP:journals/mr/PengKCKC06, author = {Chih{-}Tang Peng and Chia{-}Tai Kuo and Kuo{-}Ning Chiang and Terry Ku and Kenny Chang}, title = {Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni {UBM} on copper chip}, journal = {Microelectron. Reliab.}, volume = {46}, number = {2-4}, pages = {523--534}, year = {2006}, url = {https://doi.org/10.1016/j.microrel.2005.06.010}, doi = {10.1016/J.MICROREL.2005.06.010}, timestamp = {Sun, 02 Oct 2022 15:44:03 +0200}, biburl = {https://dblp.org/rec/journals/mr/PengKCKC06.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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