BibTeX record journals/mr/PengKCKC06

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@article{DBLP:journals/mr/PengKCKC06,
  author       = {Chih{-}Tang Peng and
                  Chia{-}Tai Kuo and
                  Kuo{-}Ning Chiang and
                  Terry Ku and
                  Kenny Chang},
  title        = {Experimental characterization and mechanical behavior analysis of
                  intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni
                  {UBM} on copper chip},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {2-4},
  pages        = {523--534},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2005.06.010},
  doi          = {10.1016/J.MICROREL.2005.06.010},
  timestamp    = {Sun, 02 Oct 2022 15:44:03 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/PengKCKC06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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