@article{DBLP:journals/mr/OldervollS04,
author = {Fr{\o}ydis Oldervoll and
Frode Strisland},
title = {Wire-bond failure mechanisms in plastic encapsulated microcircuits
and ceramic hybrids at high temperatures},
journal = {Microelectronics Reliability},
volume = {44},
number = {6},
year = {2004},
pages = {1009-1015},
ee = {http://dx.doi.org/10.1016/j.microrel.2004.02.012},
bibsource = {DBLP, http://dblp.uni-trier.de}
}