BibTeX record journals/mr/NguyenSVVKBMK02

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@article{DBLP:journals/mr/NguyenSVVKBMK02,
  author       = {H. V. Nguyen and
                  Cora Salm and
                  J. Vroemen and
                  J. Voets and
                  Benno Krabbenborg and
                  Jaap Bisschop and
                  A. J. Mouthaan and
                  Fred G. Kuper},
  title        = {Fast temperature cycling and electromigration induced thin film cracking
                  in multilevel interconnection: experiments and modeling},
  journal      = {Microelectron. Reliab.},
  volume       = {42},
  number       = {9-11},
  pages        = {1415--1420},
  year         = {2002},
  url          = {https://doi.org/10.1016/S0026-2714(02)00161-0},
  doi          = {10.1016/S0026-2714(02)00161-0},
  timestamp    = {Thu, 14 Oct 2021 09:38:49 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/NguyenSVVKBMK02.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}