@article{DBLP:journals/mr/NakadairaJSSMCKO07,
  author    = {Yoshikuni Nakadaira and
               Seyoung Jeong and
               Jongbo Shim and
               Jaiseok Seo and
               Sunhee Min and
               Taeje Cho and
               Sayoon Kang and
               Seyong Oh},
  title     = {Growth of tin whiskers for lead-free plated leadframe packages
               in high humid environments and during thermal cycling},
  journal   = {Microelectronics Reliability},
  volume    = {47},
  number    = {12},
  year      = {2007},
  pages     = {1928-1949},
  ee        = {http://dx.doi.org/10.1016/j.microrel.2007.03.008},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}