@article{DBLP:journals/mr/MicolZLAWDK09,
author = {A. Micol and
A. Zeanh and
T. Lhommeau and
Stephane Azzopardi and
E. Woirgard and
O. Dalverny and
M. Karama},
title = {An investigation into the reliability of power modules considering
baseplate solders thermal fatigue in aeronautical applications},
journal = {Microelectronics Reliability},
volume = {49},
number = {9-11},
year = {2009},
pages = {1370-1374},
ee = {http://dx.doi.org/10.1016/j.microrel.2009.06.046},
bibsource = {DBLP, http://dblp.uni-trier.de}
}