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BibTeX record journals/mr/LofranoCGB18
@article{DBLP:journals/mr/LofranoCGB18, author = {Melina Lofrano and Vladimir Cherman and Mario Gonzalez and Eric Beyne}, title = {Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly}, journal = {Microelectron. Reliab.}, volume = {87}, pages = {97--105}, year = {2018}, url = {https://doi.org/10.1016/j.microrel.2018.06.004}, doi = {10.1016/J.MICROREL.2018.06.004}, timestamp = {Thu, 14 Oct 2021 09:38:37 +0200}, biburl = {https://dblp.org/rec/journals/mr/LofranoCGB18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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