BibTeX record journals/mr/LofranoCGB18

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@article{DBLP:journals/mr/LofranoCGB18,
  author       = {Melina Lofrano and
                  Vladimir Cherman and
                  Mario Gonzalez and
                  Eric Beyne},
  title        = {Enhanced Cu pillar design to reduce thermomechanical stress induced
                  during flip chip assembly},
  journal      = {Microelectron. Reliab.},
  volume       = {87},
  pages        = {97--105},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2018.06.004},
  doi          = {10.1016/J.MICROREL.2018.06.004},
  timestamp    = {Thu, 14 Oct 2021 09:38:37 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/LofranoCGB18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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