BibTeX record journals/mr/LiuSZXYZ15

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@article{DBLP:journals/mr/LiuSZXYZ15,
  author       = {Yang Liu and
                  Fenglian Sun and
                  Hao Zhang and
                  Tong Xin and
                  Cadmus A. Yuan and
                  Guoqi Zhang},
  title        = {Interfacial reaction and failure mode analysis of the solder joints
                  for flip-chip {LED} on {ENIG} and Cu-OSP surface finishes},
  journal      = {Microelectron. Reliab.},
  volume       = {55},
  number       = {8},
  pages        = {1234--1240},
  year         = {2015},
  url          = {https://doi.org/10.1016/j.microrel.2015.05.005},
  doi          = {10.1016/J.MICROREL.2015.05.005},
  timestamp    = {Sat, 22 Feb 2020 19:26:42 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LiuSZXYZ15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}