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BibTeX record journals/mr/LiuSZXYZ15
@article{DBLP:journals/mr/LiuSZXYZ15, author = {Yang Liu and Fenglian Sun and Hao Zhang and Tong Xin and Cadmus A. Yuan and Guoqi Zhang}, title = {Interfacial reaction and failure mode analysis of the solder joints for flip-chip {LED} on {ENIG} and Cu-OSP surface finishes}, journal = {Microelectron. Reliab.}, volume = {55}, number = {8}, pages = {1234--1240}, year = {2015}, url = {https://doi.org/10.1016/j.microrel.2015.05.005}, doi = {10.1016/J.MICROREL.2015.05.005}, timestamp = {Sat, 22 Feb 2020 19:26:42 +0100}, biburl = {https://dblp.org/rec/journals/mr/LiuSZXYZ15.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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