BibTeX record: journals/mr/LiuN02a

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@article{DBLP:journals/mr/LiuN02a,
  author    = {De{-}Shin Liu and
               Chin{-}Yu Ni},
  title     = {The optimization design of bump interconnections in flip chip packages
               from the electrical standpoint},
  journal   = {Microelectronics Reliability},
  year      = {2002},
  volume    = {42},
  number    = {12},
  pages     = {1893--1901},
  url       = {http://dx.doi.org/10.1016/S0026-2714(02)00262-7},
  doi       = {10.1016/S0026-2714(02)00262-7},
  timestamp = {Tue, 23 Sep 2014 02:46:36 +0200},
  biburl    = {http://dblp.uni-trier.de/rec/bib/journals/mr/LiuN02a},
  bibsource = {dblp computer science bibliography, http://dblp.org}
}