DBLP BibTeX Record 'journals/mr/LiuN02a'

@article{DBLP:journals/mr/LiuN02a,
  author    = {De-Shin Liu and
               Chin-Yu Ni},
  title     = {The optimization design of bump interconnections in flip
               chip packages from the electrical standpoint},
  journal   = {Microelectronics Reliability},
  volume    = {42},
  number    = {12},
  year      = {2002},
  pages     = {1893-1901},
  ee        = {http://dx.doi.org/10.1016/S0026-2714(02)00262-7},
  bibsource = {DBLP, http://dblp.uni-trier.de}
}