BibTeX record journals/mr/LiuMSN18

download as .bib file

@article{DBLP:journals/mr/LiuMSN18,
  author       = {Shi{-}Qian Liu and
                  Stuart D. McDonald and
                  Keith W. Sweatman and
                  Kazuhiro Nogita},
  title        = {The effects of precipitation strengthening and solid solution strengthening
                  on strain rate sensitivity of lead-free solders: Review},
  journal      = {Microelectron. Reliab.},
  volume       = {84},
  pages        = {170--180},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2018.03.038},
  doi          = {10.1016/J.MICROREL.2018.03.038},
  timestamp    = {Sat, 22 Feb 2020 19:27:02 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LiuMSN18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.